Brief: Discover the UL HDI PCB Board, a high-density interconnect solution for consumer electronics. Featuring 0.2-3.2mm thickness and 8oz copper, this board ensures efficient signal transmission and compact design. Perfect for smartphones, wearables, and more.
Related Product Features:
High-density interconnect technology for advanced consumer electronics.
Multiple copper layers (1/3oz to 8oz) for superior conductivity.
Vias aspect ratio of 16:1 for increased connection density.
Min. core thickness of 0.05mm for compact and lightweight designs.
Precise layer alignment with +/- 0.06mm misalignment tolerance.
Impedance control at ±8% for improved signal integrity.
Suitable for miniaturized devices like smartphones and wearables.
Customizable options for various industry applications.
FAQ:
What is the copper thickness range of the HDI PCB Board?
The copper thickness ranges from 1/3oz to 8oz, ensuring high conductivity for efficient signal transmission.
What applications is the HDI PCB Board suitable for?
It is ideal for consumer electronics such as smartphones, tablets, wearables, and high-speed data transmission devices.
What is the misalignment tolerance of the HDI PCB Board layers?
The board features a precise misalignment tolerance of +/- 0.06mm, ensuring reliable and accurate connections.